ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
PACKAGE DIMENSIONS
SOD ? 523
CASE 502
ISSUE E
? X ?
2X
b
0.08
M
1
X Y
D
TOP VIEW
2
E
A
? Y ?
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
MILLIMETERS
DIM
MIN NOM MAX
0.50 0.60 0.70
A
0.25 0.30 0.35
b
0.07 0.14 0.20
c
1.10 1.20 1.30
D
0.70 0.80 0.90
E
1.50 1.60 1.70
H E
0.30 REF
L
0.15 0.20 0.25
L2
c
H E
SIDE VIEW
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
2X
L
RECOMMENDED
SOLDERING FOOTPRINT*
2X
L2
2X
0.48
1.80
2X
0.40
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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ESD5Z2.5T1/D
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